1064nm infrared ultrafast laser

Application Field:

Ceramic Cutting

Glass, sapphire and other hard & brittle materials Cutting

OLED, FPC, TFT and other materials precision Cutting

Special Glass Cutting

Aluminum alloy, Copper, Stainless Steel, Precision MarkingSingle Crystal Silicon Precision Cutting

Product Features

Single Pulse Energy up to 500uJ~1mJ

Stable power output

Industrial products

pulse width around 10ps

Excellent beam quality

Technical Parameters

Center Wavelength (nm) : ~1064nm

Pulse Width (ps) :   ~10ps

Output Power (W) : ~10W

Mode: TEM00

Windows Diameter (mm) :  ~ 2mm

Circularity: >85%

Divergence Angle: ~1.5mrad

Energy Stability: ~2%

Power Stability:  ~2%

Boresight: ~50urad

Beam Quality (M2) : ~1.2

Cooling: DI Water

Supply Voltage (VAC) : 220V, 50Hz

Laser Head Dimension L*W*H (mm) : 890*490*138

Power Supply Dimension L*W*H (mm) : 625*485*180

Operating Temperature (℃) : 20 to 30

Operating Humidity (%) :<65%